Opening of a new semiconductor research center in Dresden

Fraunhofer IPMS and Fraunhofer IZM-ASSID created the Center for Advanced CMOS & Heterointegration Saxony.

A flagship of semiconductor research with international reach is emerging in Dresden. Fraunhofer IPMS and Fraunhofer IZM-ASSID combine their skills and create the Center for Advanced CMOS & Heterointegration Saxony, which recently celebrated its opening. The center will offer the entire 300 mm microelectronics value chain, a sine qua non for cutting-edge research into the technologies of the future.

With Fraunhofer IZM-ASSID and Fraunhofer IPMS’ Center Nanoelectronic Technologies CNT, two unique research facilities in Germany in the field of microelectronics are located in Saxony. Today they are the only two German research centers for applied microelectronics research based on 300mm wafer industry standard equipment.

With the pooling of skills and the founding of the Center for Advanced CMOS & Heterointegration Saxony, there are excellent prospects for attracting semiconductor companies and system users as well as material and equipment manufacturers from all over the world. In addition to excellent personnel and know-how, equipment with a fleet of modern equipment and factories is crucial for industrial and research contracts.

With an investment volume of approximately 140 million euros in clean room facilities, Fraunhofer IPMS occupies a unique position in Germany in the field of applied research on the modern industrial standard of 300 mm wafers in the front- end of CMOS manufacturing. In future, the center will be led by Dr. Wenke Weinreich, Division Head at CNT and Deputy Director of the Fraunhofer Institute IPMS, and Dr. Manuela Junghähnel, Site Manager at IZM-ASSID.

“The joint center with a 4000 square meter clean room enables close cooperation and networking of the scientific and technical skills of the two research institutes. This creates an outstanding R&D technology platform as well as an increase in efficiency and the completion of the value chain, which at the same time opens up new fields of research,” says Dr. Junghähnel.

“The industry standard of 300mm wafers is crucial, as it is the only way to ensure rapid transfer of research results to the semiconductor industry in Saxony, nationally and also in the world,” added Dr. Weinreich. “On the other hand, this wafer standard is also a basic requirement for high-tech research for future technologies, such as neuromorphic and quantum computing.”

The Center for Advanced CMOS & Heterointegration Saxony is being built at one of the Fraunhofer IPMS sites in Dresden.

“Saxony is one of the leading locations for microelectronics in Europe,” said Saxony Prime Minister Michael Kretschmer. Every third European chip is produced in the Free State of Saxony. Saxony relies on close networking between industry, science and research. The new Fraunhofer Center for Semiconductor Research is unique in Germany and will make a decisive contribution to innovation in Silicon Saxony. In the future, applied research in microelectronics with state-of-the-art 300mm wafers will take place in Dresden globally. I thank the Fraunhofer-Gesellschaft for its clear commitment to Saxony as a location.”

For the future development of the necessary skills in microelectronics and microsystems technology, the Fraunhofer IZM-ASSID and Fraunhofer IPMS R&D offerings for 300 mm process skills will be designed and extended in such a way that local industry and nationally, from SMEs to large corporations (e.g. Globalfoundries, Infineon Bosch) will be able to benefit from the latest technologies in the best possible way.

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